SUPERNOVA™轻薄型单片式压缩阵列

外形高度低至1.27 mm的高速轻薄型单片式压缩阵列,拥有双重压缩或单一压缩端子。

特色

  • 1.27 mm标准外形高度
  • 1.00 mm间距
  • 含焊接球的双压或单一压缩
  • 共有100 - 300个端子
  • 低成本电路板堆叠、模块对板和LGA接口的理想选择
  • 最大程度地消除热膨胀问题
  • Analog Over Array™能力

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Samtec高级互联设计技术中心

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GMI

1.00 mm SUPERNOVA™轻薄型压缩转接板

特色
  • 双压端子
  • 多达300个I/O口
  • 轻薄型 - 1.27 mm标准高度
  • Analog Over Array™能力
1.00 mm SUPERNOVA™轻薄型压缩转接板

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