中板光学系统

FireFly™ Micro Flyover System™是一种面向未来的盒装中板光学互连解决方案,性能可达到每通道28 Gbps,而且可迁移至56 Gbps。该系统易于装配,设计可使用相同的高性能连接器套件实现铜缆和光缆的互换,可改善信号完整性,增加信号路径长度,以满足当今和下一代数据速率要求。凭借业界领先的微型封装,FireFly™支持更大的密度,可以更靠近IC,从而实现芯片到芯片、板对板、板载以及系统到系统的连接。


Firefly™ Micro Flyover System™微型Flyover板载光学引擎,FireFly™

面向未来的系统,具有FireFly™铜线和光纤的互换性,使用相同的微型MXC连接器系统,每通道速度高达 28 Gbps。

特色
  • 高速性能,每通道可达28 Gbps
  • x4和x12设计
  • 多种集成散热器和终端2方案
  • 铜缆与光纤互换性
  • 微型耐用型双件式连接器
  • 宽温光纤PCIe®解决方案
产品
V
  • ECUO
  • PCUO
  • ETUO
  • ETMO
  • PTUO
  • ECUE
  • PCUE
  • UEC5-1
  • UEC5-2
  • UCC8
  • PCOA
Firefly™ Micro Flyover System™

Halo™Halo™下一代光学收发机 - 开发中

开发中 - 专为要求在轻薄、坚固的外型中实现56/112 Gbps PAM4性能的下一代嵌入式应用而设计。

特色
  • 多达16个通道(双向8个通道);每通道112 Gbps PAM4
  • 轻薄型,采用2件式端子系统
  • 设计用于承受剧烈冲击和振动
  • 重心低,可稳定连接到电路板
  • 可插拔光学器件,便于现场更换
  • 与协议无关
  • 支持数据中心、HPC和FPGA协议,包括10/40/100/400/800 GbE以太网、InfiniBand™、光纤通道、PCIe®、CXL®和Aurora
  • 多种散热器选项,适用于传导、对流、冷板或液体冷却散热
  • 耐用型表面安装连接器采用集成锁扣锁紧机制,简化了电缆组件的对接/拆拔
  • Halo™光纤、铜缆和有源铜缆系统可与同类高性能表面安装连接器互换
产品
V
Halo™

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