开发中 - 专为要求在轻薄、坚固的外型中实现56/112 Gbps PAM4性能的下一代嵌入式应用而设计。

特色

  • 多达16个通道(双向8个通道);每通道112 Gbps PAM4
  • 轻薄型,采用2件式端子系统
  • 设计用于承受剧烈冲击和振动
  • 重心低,可稳定连接到电路板
  • 可插拔光学器件,便于现场更换
  • 与协议无关
  • 支持数据中心、HPC和FPGA协议,包括10/40/100/400/800 GbE以太网、InfiniBand™、光纤通道、PCIe®、CXL®和Aurora
  • 多种散热器选项,适用于传导、对流、冷板或液体冷却散热
  • 耐用型表面安装连接器采用集成锁扣锁紧机制,简化了电缆组件的对接/拆拔
  • Halo™光纤、铜缆和有源铜缆系统可与同类高性能表面安装连接器互换

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