Samtec Q Strip®差分对夹层连接器专为注重信号完整性的高速板对板应用而设计。

特色

  • 性能:10.5 GHz / 21 Gbps
  • 针对100欧姆系统进行了优化
  • 佩带电源/接地
  • 堆叠高度:5.00-25.00 mm
  • 端子:最多有100对

视频

Q Series®高速互连器

Samtec高级互联设计技术中心

产品

QSH-DP

0.50 mm Q Pairs®高速接地平面插座料带,差分对

特色
  • 轻薄型5 mm堆叠高度
  • 多达80个差分对
  • 高达9.5 GHz / 19 Gbps
  • 0.50 mm(.0197")间距
0.50 mm Q Pairs®高速接地平面插座料带,差分对

QTH-DP

0.50 mm Q Pairs®高速接地平面针脚料带,差分对

特色
  • 0.50 mm(.0197")间距
  • 高达9.5 GHz / 19 Gbps
  • 多达80个差分对
  • 轻薄型5 mm堆叠高度
0.50 mm Q Pairs®高速接地平面针脚料带,差分对

QSS-DP

0.635 mm Q Pairs®高速接地平面插座料带,差分对

特色
  • 轻薄型5 mm堆叠高度
  • 多达64个差分对
  • 高达8.5 GHz / 17 Gbps
  • 0.635 mm(.025")间距
0.635 mm Q Pairs®高速接地平面插座料带,差分对

QTS-DP

0.635 mm Q Pairs®高速接地平面针脚料带,差分对

特色
  • 0.635 mm(.025")间距
  • 轻薄型5 mm堆叠高度
  • 多达64个差分对
  • 高达8.5 GHz / 17 Gbps
0.635 mm Q Pairs®高速接地平面针脚料带,差分对

QSE-DP

0.80 mm Q Pairs®高速接地平面插座料带,差分对

特色
  • 0.80 mm(.0315")间距
  • 高达8.5 GHz / 17 Gbps
  • 多达56个差分对
  • 轻薄型5 mm堆叠高度
0.80 mm Q Pairs®高速接地平面插座料带,差分对

QTE-DP

0.80 mm Q Pairs®高速接地平面针脚料带,差分对

特色
  • 0.80 mm(.0315")间距
  • 高达8.5 GHz / 17 Gbps
  • 多达56个差分对
  • 轻薄型5 mm堆叠高度
0.80 mm Q Pairs®高速接地平面针脚料带,差分对

QSH-DP-RA

0.50 mm Q Pairs®高速接地平面插座料带,差分对,直角

特色
  • 0.50 mm(.0197")间距
  • 导柱
0.50 mm Q Pairs®高速接地平面插座料带,差分对,直角

QTH-DP-RA

0.50 mm Q Pairs®高速接地平面针脚料带,差分对,直角

特色
  • 0.50 mm(.0197")间距
  • 导柱
0.50 mm Q Pairs®高速接地平面针脚料带,差分对,直角

联系销售

电子邮件
公司
行业
预计年用量
系列
消息

不想填表格?
直接与产品专家在线聊天

.
A friend of mine told me his birthday was coming up. He told me it was his 15th. “What?” I thought. He’s older than me. He then told me his […] The post 15 or 60? – Leap Years Explained appeared first on The Samtec Blog....
High-Speed Twinax Cable Solutions To 224 and 112 Gbps PAM4 At DesignCon 2024, Samtec had several live product demonstrations showing a wide variety of Samtec Flyover® cable solutions, all with […] The post New Rugged, High-Speed Twinax Cable Solutions appeared first on The Samtec...
We are faced with choices all day long – some easy and some hard. It can be overwhelming when the options are numerous and any research on the internet is […] The post New High-Speed Board-to-Board & Backplane Guide: A Pile of Choices appeared first on The Samtec Blog....
Semiconductor design is constantly evolving, resulting in more complex, specialized, and integrated systems that push the boundaries of performance. As new technologies and methodologies emerge, semiconductor designers need access to […] The post Samtec Supports Semiconductor Dev...
DesignCon 2024 has just announced its Best Paper Awards winners, and six Samtec authors are honored alongside their colleagues from other organizations. Somewhat unique in the world of “conference paper […] The post Six Samtec Authors Win DesignCon Best Paper Awards appeared firs...