SUPERNOVA™轻薄型压缩转接板

高度为1.27毫米,具有双压端子,高速、轻薄型单片式转接板。

特色

  • 1.27 mm标准外形高度
  • 1.00 mm间距
  • 双压端子
  • 共有100 - 300个端子
  • 低成本电路板堆叠、模块对板和LGA接口的理想选择
  • 最大程度地消除热膨胀问题
  • Analog Over Array™能力

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1.00 mm SUPERNOVA™轻薄型压缩转接板

特色
  • 双压端子
  • 多达300个I/O口
  • 轻薄型 - 1.27 mm标准高度
  • Analog Over Array™能力
1.00 mm SUPERNOVA™轻薄型压缩转接板

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