Samtec - 直连IC封装

Samtec的产品线包括两种提供直接连接技术的互连器:FireFly™和Si-Fly™。 这些互连能够无需BGA而直接连接到IC封装,并通过长距离电缆路由来自硅晶片的信号。由于其高密度的设计,因此可以达到25.6 TB的总数据速率,并可能达到51.2 TB。FireFly™现已供货,通道速度可达56 Gbps PAM4。Si-Fly™正在开发中(2020年上市),通道速度可达112 Gbps PAM4甚至更高。

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OFC, the Optical Fiber Communications Conference, is all about optical networking and communications. Samtec was front and center showcasing 224 Gbps PAM4 solutions, next-generation transceivers for optical and copper, CXL-over-optics, […] The post Cutting Edge Copper and Optical...