Samtec - 直连IC封装

Samtec的产品线包括两种提供直接连接技术的互连器:FireFly™和Si-Fly™。 这些互连能够无需BGA而直接连接到IC封装,并通过长距离电缆路由来自硅晶片的信号。由于其高密度的设计,因此可以达到25.6 TB的总数据速率,并可能达到51.2 TB。FireFly™现已供货,通道速度可达56 Gbps PAM4。Si-Fly™正在开发中(2020年上市),通道速度可达112 Gbps PAM4甚至更高。

Designers frequently ask how much gold plating they should specify on the connector pins. As I write this blog, (and yes, I’m old-fashioned and am actually typing it; I’m not using […] The post Gold Plating On Connectors: How Much Do I Need? appeared first on The Samtec Blog....
Samtec Harrisburg attended the 17th annual Penn State Harrisburg Signal/Power Integrity Symposium and MASH Forum on Friday, April 19th 2024, hosted by the Center for Signal Integrity. The main goal of the […] The post Samtec Design Center Attends Annual Penn State Harrisburg SI/P...
As the world gears up to celebrate the 150th running of the Kentucky Derby,the excitement is intense. This iconic event isn’t just about horse racing;it’s a celebration of tradition, athleticism, […] The post Celebrating Community and Innovation: Samtec’s Connection to the 150th ...
Wait . . . An AI hardware platform without a GPU? Is that even possible? Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative […] The post New AMD Versal AI Edge SoM and Carrier Card From Avnet Feature Samtec Interconnects appeared ...
Artificial Intelligence. Or, the intelligence of computers. It’s all around us, but I think it’s important to remember that this intelligence is driven by human intelligence. It’s the human innovation behind […] The post Artificial Intelligence: How to Manage High Amounts of Dat...