Samtec COM-HPC®互连器

COM-HPC®的开发超出了嵌入式计算机对高速性能的需求,并为下一代嵌入式系统设计提供了可扩展性。此标准中包含的Samtec互连器可提供5 mm和10 mm堆叠高度、0.635 mm间距的400端子开放式端子、BGA连接和高达112 Gbps PAM4的性能。请观看视频以了解更多信息。https://www.samtec.com/standards/picmg/comhpc

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