CPC

开发中:铜制Si-Fly™轻薄型高密度电缆系统

CPC

开发中:铜制Si-Fly™轻薄型高密度电缆系统

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特色

  • 与IC封装相邻的超薄型互连器
  • 超高密度实现了25.6 TB总数据速率,路径高达51.2 TB
  • 每通道112 Gbps PAM4
  • PCIe® 6.0/CXL® 3.1能力
  • 路程是传统PCB解决方案的5倍
  • 避开BGA并通过长程电缆直接路由来自硅封装的信号
技术配套元件

形式安全,无垃圾邮件。

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