BSP

  使用下列选项配置您的产品

BSP

XCede® HD高密度背板定制直角模块

配置零件编号
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特色

  • 完全定制模块,以满足特定的应用要求
  • 在任何HDTF(信号)、电源和锁合/导引配置中组合任意数字,以创建一个BSP产品
  • 电源和锁合/导引仅适用于自定义配置
  • 欲了解仅关于信号解决方案,请参阅HDTF系列
  • 联系方式 [email protected] (获取有关构建BSP产品的帮助)
技术配套元件

形式安全,无垃圾邮件。

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Designers frequently ask how much gold plating they should specify on the connector pins. As I write this blog, (and yes, I’m old-fashioned and am actually typing it; I’m not using […] The post Gold Plating On Connectors: How Much Do I Need? appeared first on The Samtec Blog....
Samtec Harrisburg attended the 17th annual Penn State Harrisburg Signal/Power Integrity Symposium and MASH Forum on Friday, April 19th 2024, hosted by the Center for Signal Integrity. The main goal of the […] The post Samtec Design Center Attends Annual Penn State Harrisburg SI/P...
As the world gears up to celebrate the 150th running of the Kentucky Derby,the excitement is intense. This iconic event isn’t just about horse racing;it’s a celebration of tradition, athleticism, […] The post Celebrating Community and Innovation: Samtec’s Connection to the 150th ...
Wait . . . An AI hardware platform without a GPU? Is that even possible? Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative […] The post New AMD Versal AI Edge SoM and Carrier Card From Avnet Feature Samtec Interconnects appeared ...
Artificial Intelligence. Or, the intelligence of computers. It’s all around us, but I think it’s important to remember that this intelligence is driven by human intelligence. It’s the human innovation behind […] The post Artificial Intelligence: How to Manage High Amounts of Dat...