网络研讨会:分路布线设计:封装和走线

主讲人:Scott McMorrow | Scott McMorrow将解释封装与走线的分路布线区域 (BOR) 设计所面对的技术挑战,并介绍它们是如何显着影响通道性能的。他将通过一个具体示例,为近封装电缆 (NPC) BOR的封装侧设计提供指导。该BOR在一个30层板上包含了1mm间距的球,以达到112Gbps PAM4的速度。诚邀您加入本次关于“final inch”设计的技术讨论,并在会上提出您的问题。

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