与硅封装直接连接 -- OFC 2020

Samtec Direct Connect™技术可实现56 Gbps PAM4和112 Gbps PAM4系统,这些系统可以避开BGA跟踪。通过Direct Connect,Samtec Flyover®电缆组件可直接插入封装。这一技术有助于许多其他技术的应用,包括AI、机器学习、5G、仿真和高性能计算。

Wait . . . An AI hardware platform without a GPU? Is that even possible? Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative […] The post New AMD Versal AI Edge SoM and Carrier Card From Avnet Feature Samtec Interconnects appeared ...
Artificial Intelligence. Or, the intelligence of computers. It’s all around us, but I think it’s important to remember that this intelligence is driven by human intelligence. It’s the human innovation behind […] The post Artificial Intelligence: How to Manage High Amounts of Dat...
Our modern industrial world depends on raw materials. Whether oil, steel or cotton, raw materials have been of huge importance to the development of the industriaized world. While these physical […] The post Connectors for HPC and Supercomputing appeared first on The Samtec Blog....
Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will […] The post From AI to SI: Samtec Participates on Two Upcoming Webinars appeared...
There are several Advantages of Being a Samtec Co-Op, but at the heart of the Samtec Co-Op program, the main goal is to foster, nurture, and provide engaging, hands on […] The post An Interview with Business Co-Op’s at Samtec appeared first on The Samtec Blog....