COM-HPC®标准产品和支持

COM-HPC®标准产品和支持

概述

COM-HPC®的开发超出了嵌入式计算机对高速性能的需求。COM-HPC®有望在2021年初获得批准,它与COM Express®规范共存,但是为下一代嵌入式系统设计提供了可伸缩性和增强的性能。

COM-HPC®支持两种不同的模块类型。COM-HPC®服务器模块面向边缘服务器应用。COM-HPC®客户端模块支持强大的嵌入式计算。

COM-HPC®可为GPGPU、FPGA和DSP等各种计算引擎提供更多的系统内存(高达1 TB)和系统灵活性。

com-hpc视频图标
COM-HPC手册

COM-HPC®互连方案

下载PDF文件
COM-HPC®标志
COM-HPC®客户端 COM-HPC®服务器端
49x PCIe 65x PCIe
2x MIPI-CSI
2x 25GbE KR 8x 25GbE KR
3x DDI
2x BaseT(高达10 Gb)
2x SoundWire, I2S BaseT(高达10 Gb)
4x USB4 2x USB4
2x USB3.2
4x USB2.0 4x USB2.0
2x SATA 2x SATA
eSPI, 2x SPI, SMB eSPI, 2x SPI, SMB
2x I2C, 2x UART 2x I2C, 2x UART
12x GPIO 12x GPIO

COM-HPC®连接器

COM-HPC®通过采用基于Samtec的AcceleRate® HP高性能阵列的一对400端子连接器(共800端子)提供系统和接口灵活性。Samtec符合COM-HPC®标准的连接器支持现有和将来的接口,例如PCIe® 5.0(32 Gbps)以及最高100 Gb的以太网。

母模块插座在标准高度使用。公针载入插头有不同高度,以实现5 mm或10 mm堆叠高度。

根据应用的不同,连接器端子引脚针对COM-HPC®规范中定义的客户端或服务器端模块进行了优化。

asp特写

打印版资料

带焊接片新款
5 mm堆叠高度 10 mm堆叠高度
模块插座(ASP-230332-01) 模块插座(ASP-230332-01)
载入插头(ASP-230333-01) 载入插头(ASP-230336-01)
无焊接片
5 mm堆叠高度 10 mm堆叠高度
模块插座(ASP-209946-01) 模块插座(ASP-209946-01)
载入插头(ASP-214802-01) 载入插头(ASP-209948-01)
配置零件编号

ASP-214802-01


测试报告


COM-HPC®标准

有关COM-HPC®标准和其他信息的问题,请通过以下方式与我们联系:


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