微电子

互连方案

新一代微电子技术需要更高的性能与集成性、先进的芯片技术及小型化。

Samtec广泛的微电子和高速互连专业知识及经验证的封装集成技术、微型化、晶圆级加工和信号完整性优化,使我们能够为先进的微电子应用提供独特的支持。

A friend of mine told me his birthday was coming up. He told me it was his 15th. “What?”, I thought. He’s older than me. He then told me his […] The post 15 or 60? – Leap Years Explained appeared first on The Samtec Blog....
High-Speed Twinax Cable Solutions To 224 and 112 Gbps PAM4 At DesignCon 2024, Samtec had several live product demonstrations showing a wide variety of Samtec Flyover® cable solutions, all with […] The post New Rugged, High-Speed Twinax Cable Solutions appeared first on The Samtec...
We are faced with choices all day long – some easy and some hard. It can be overwhelming when the options are numerous and any research on the internet is […] The post New High-Speed Board-to-Board & Backplane Guide: A Pile of Choices appeared first on The Samtec Blog....
Semiconductor design is constantly evolving, resulting in more complex, specialized, and integrated systems that push the boundaries of performance. As new technologies and methodologies emerge, semiconductor designers need access to […] The post Samtec Supports Semiconductor Dev...
DesignCon 2024 has just announced its Best Paper Awards winners, and six Samtec authors are honored alongside their colleagues from other organizations. Somewhat unique in the world of “conference paper […] The post Six Samtec Authors Win DesignCon Best Paper Awards appeared firs...