LP Array™ SI评估套件

适用于评估LP Array™轻薄型开放式端子阵列的SI测试平台


概述

Samtec LP Array™轻薄型开放式端子阵列支持高速、高密度应用,具有最高的布线和接地灵活性。LP Array™ SI评估套件为系统设计人员和SI工程师提供了测试LP Array™连接器的一种易用型解决方案。

LP Array™ SI评估套件提供具有强大机械设计的高质量系统,可单独用于LP Array™连接器。有关更多信息,请通过 [email protected] 联系Samtec的技术专家。

LP阵列REF200470
Samtec零件编号REF-200470-X.XX-X.XX-01,如图

特色

  • 外形紧凑的两个PCB系统
  • 一个PCB包含LPAM连接器 (LPAM-40-XX-X-L-08-2-K-TR)
  • 另一个PCB包含LPAF连接器 (LPAF-40-XX.X-L-08-2-K-TR)
  • 支持多种LPAM/LPAF堆叠高度 (4 mm/4.5 mm/5 mm)
  • 将高速差分对(总共20个)从 LPAM/LPAF连接器路由至高精度射频连接器
  • 支持多种高精度射频连接器选项 (2.40 mm/2.92 mm SMA)
  • 通过Samtec FinalInch® BOR PCB追踪路由优化的‘SI性能
  • 通过直接连接到TDR/TDT来启用时域测量
  • 通过直接连接到VNA来启用频域测量

应用

  • FPGA/SoC开发板
  • 服务器
  • 存储
  • 网络
  • 测试和测量
  • 有线通信
  • 无线通信

订购信息

有关更多详情,请参见图样REF-200470-X.XX-X.XX-01

联系方式 [email protected] (其他订购信息)

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